EVA Mitsui Chemicals 210
EVA Mitsui Chemicals 210
Product Introduction EVA Mitsui Chemicals 210 resin is an ethylene‑vinyl‑acetate copolymer with vinyl acetate (VA) content of 28.0 wt% and ultra‑high melt flow rate of 400 g/10min. Thanks to its unique properties, it is widely used especially in adhesive‑related industries.
Main Applications
Hot‑melt Adhesives: Its core application field. Well‑suited for hot‑melt adhesive manufacturing for book binding, packaging, furniture edge‑banding, automotive interior assembly and shoemaking. High flowability and wet‑out performance guarantee excellent bonding effect.
Sealants: Used for the production of sealing materials.
Resin Modification: Blended with other resins such as polyethylene and polypropylene to improve flexibility, impact resistance and processability.
Wire and Cable: Suitable for sheath materials for halogen‑free flame‑retardant cables, semiconductor shielding materials and certain special‑purpose cables.
Foamed Products: Can produce soft foamed materials, though ultra‑high‑MFR grades are less common for foaming compared with dedicated foaming EVA grades.
Films: Used for functional films including packaging films and medical‑grade films.
Performance Parameters
| Performance Category | Test Item | Test Standard | Test Data | Unit |
|---|---|---|---|---|
| Basic Physical Properties | Vinyl Acetate (VA) Content | ‑ | 28.0 | wt% |
| Melt Flow Rate (MFR) | 190°C/2.16 kg | 400 | g/10min | |
| Density / Specific Gravity | ASTM D792, ISO 1183 | 0.950‑0.951 | g/cm³ | |
| Thermal Properties | Vicat Softening Temperature | ASTM D1525, ISO 306 | 39.0 | ℃ |
| Melting Peak Temperature | ASTM D3418, ISO 3146 | 60.0 | ℃ | |
| Mechanical Properties | Shore Hardness A | JIS K7215 | Data not available | ‑ |
| Tensile Strength at Break | JIS K7161 | Data not available | MPa | |
| Elongation at Break | JIS K7161 | Data not available | % |
Processing Processes & Parameters
Mitsui Chemicals 210 EVA supports multiple thermoplastic processing methods: extrusion (extrusion coating, wire‑cable sheaths, films, etc.), injection molding, hot‑melt coating (typical processing method for adhesives), foaming molding and blow molding. Its ultra‑high melt flow rate and relatively low thermal‑decomposition temperature shall be fully considered when setting process parameters.
Processing Characteristics & Key Points Drying: If moisture‑absorbed, dry at 65‑80℃ for 2‑3 hours to avoid bubbles or silver streaks. For this ultra‑high‑MFR grade, follow supplier‑recommended drying conditions.
Processing Temperature: Critical for EVA 210 processing. Melt temperature shall be kept below 230℃. Excessively high temperature will cause material degradation (thermal‑decomposition temperature approx.230‑250℃). Typical processing temperature ranges from 150‑200℃ and should be adjusted for individual equipment and products.
Mold Temperature: Low mold temperature such as 20‑40℃ is recommended.
Equipment Selection: Due to extremely low melt viscosity, pay attention to barrel and screw sealing and back‑flow control during injection or extrusion to prevent material back‑flow and screw slipping.
Cooling: Fast cooling is required for product setting.
Note: All data above is for reference only.
